Thermal engineering for AI infrastructure.
Heat is the dominant constraint of the AI era. We engineer the cooling loops, manifolds, and thermal control systems that unlock rack density without compromise.
GPU thermal density redefines the loop.
Modern accelerators concentrate kilowatts of dissipation into centimeters of silicon. Air cannot follow. Liquid cooling becomes structural — not optional.
Liquid cooling evolution.
Rear-Door HX
Transitional heat exchange for mid-density legacy refresh.
Direct-to-Chip
Cold plate loops engineered for high-density GPU clusters.
Single-Phase
Dielectric and water-glycol loops with precise flow control.
Two-Phase
Latent-heat-driven systems for frontier-class accelerator density.
The loop is the building.
In an AI-class hall the cooling loop is no longer mechanical support — it is the structural backbone the compute hangs on.
AI thermal architecture as a system.
CDUs, manifolds, secondary loops, and facility heat rejection are designed in one model — with telemetry feeding live thermal control across every rack.